| 品名 | 敘述 | 詢價 |
|---|---|---|
| Ammonium Fluoride (NH4F) | 用於二氧化矽 (SiO2) 和矽酸鹽材料的蝕刻過程。 | |
| Acetic Acid (CH3COOH) | Used in photolithography and cleaning processes to remove organic residues and improve adhesion of photoresists. | |
| n-Butyl Acetate (NBA) | IC, Logic, Memory, MEMS | |
| r-Butyrolactone (GBL) | IC, Logic, Memory, MEMS | |
| Butyl Diglycol (BDG) | IC, Logic, Memory, MEMS | |
| Dimethyl Sulfoxide (DMSO) | IC, Logic, Memory, MEMS | |
| Isopropanol (IPA) | IC, Logic, Memory, MEMS | |
| Methanol | IC, Logic, Memory, MEMS | |
| Monoethanolamine (MEA) | IC, Logic, Memory, MEMS | |
| n-Methyl-2-Pyrrolidone (NMP) | IC, Logic, Memory, MEMS | |
| Propylene Glycol Methyl Ether (PGME) | IC, Logic, Memory, MEMS | |
| Propylene Glycol Methyl Ether Acetate (PGMEA) | IC, Logic, Memory, MEMS |