蝕刻後清洗劑

品名	敘述	詢價
SPR Series	Logic, IC, Bumping, packaging, legacy SPR series are uniquely formulated chemistry designed specifically for the removal of positive PR and dry etched PR residue without damage to Al, Cu, Ti, and W for Al process and low-k, Cu, Ta, TaN and SiC in IC Cu process. New formulations are available to meet environmental regulations (non-NMP, non-DMSO, non-Sulfolane)
Stripper and Cleaners	Logic, IC, Bumping, packaging, legacy SPR series are uniquely formulated chemistry designed specifically for the removal of positive PR and dry etched PR residue without damage to Al, Cu, Ti, and W for Al process and low-k, Cu, Ta, TaN and SiC in IC Cu process. New formulations are available to meet environmental regulations (non-NMP, non-DMSO, non-Sulfolane)
PER Series	Logic, IC, Bumping, packaging, legacy process, CoWaS, TSV, ESG PER series cleaners are newly developed formulations for removing polymer residues after etching. Specially designed to meet the needs of from advanced tech nodes in foundries and TSV for backend processes.
Cleaners	Logic, IC, Bumping, packaging, legacy process, CoWaS, TSV, ESG PER series cleaners are newly developed formulations for removing polymer residues after etching. Specially designed to meet the needs of from advanced tech nodes in foundries and TSV for backend processes.