電鍍

品名	敘述	詢價
CPM solution	Memory, Cu, W, acidic type Pillar bump CPM series solution is formulated chemicals designed specifically for Cu plating in the Pillar Bump process. Pillar bump CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application.
Cu Pillar Bump plating	Memory, Cu, W, acidic type Pillar bump CPM series solution is formulated chemicals designed specifically for Cu plating in the Pillar Bump process. Pillar bump CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application.
CPM solution	Memory, Cu, alkaline type RDL CPM solution is formulated chemicals designed specifically for Cu plating in the RDL process. RDL CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application.
Cu RDL plating	Memory, Cu, alkaline type RDL CPM solution is formulated chemicals designed specifically for Cu plating in the RDL process. RDL CPM solution are formulas based on H2SO4, CuSO4 5H2O and organic additives, and provide appropriate secondary current distribution to satisfy bumping process application.