| 品名 | 敘述 | 詢價 |
|---|---|---|
| 氫氟酸 (HF) | 3nm-130nm | |
| Hydrochloric Acid (HCl) | 3nm-130nm | |
| Ammonium Fluoride (NH4F) | 用於二氧化矽 (SiO2) 和矽酸鹽材料的蝕刻過程。 | |
| 醋酸 (CH3COOH) | 用於光刻和清潔過程中,去除有機殘留物並改善光刻膠的附著力。 | |
| Hydrogen Peroxide (H2O2) | 3nm-130nm | |
| Nitric Acid (HNO3) | 3nm-130nm | |
| Phosphoric Acid (H3PO4) | 3nm-130nm | |
| Sulfuric Acid (H2SO4) | 3nm-130nm | |
| Ammonium Hydroxide (NH4OH) | 3nm-130nm | |
| Potassium Hydroxide solution (KOH) | 3nm-130nm | |
| Sodium Hydroxide solution (NaOH) | 3nm-130nm | |
| Tetramethylammonium Hydroxide solution (TMAH) | 3nm-130nm |