化學機械研磨後清洗劑

品名	敘述	詢價
CMP-M Series	Memory, Cu, W, acidic type CMP-M series post CMP cleaning solution is formulated chemicals designed specifically for post copper and tungsten CMP cleaning. CMP-M series cleaners have outstanding cleaning performance for particles and metals and cost reduction with high dilution ratio.
Acidic post CMP cleaning solution	Memory, Cu, W, acidic type CMP-M series post CMP cleaning solution is formulated chemicals designed specifically for post copper and tungsten CMP cleaning. CMP-M series cleaners have outstanding cleaning performance for particles and metals and cost reduction with high dilution ratio.
CMP-B Series	Memory, Cu, alkaline type CMP-B series post CMP cleaning solution is formulated chemicals designed specifically for post copper CMP cleaning with cobalt as barrier. CMP-B series cleaners have outstanding cleaning performance for particle, metal, and organic residue. It controls galvanic corrosion to barrier metals. High cost reduction POU dilution ratio more than 100 times.
Alkaline post CMP cleaning solution	Memory, Cu, alkaline type CMP-B series post CMP cleaning solution is formulated chemicals designed specifically for post copper CMP cleaning with cobalt as barrier. CMP-B series cleaners have outstanding cleaning performance for particle, metal, and organic residue. It controls galvanic corrosion to barrier metals. High cost reduction POU dilution ratio more than 100 times.