化學機械研磨液

化學機械研磨液

品名 敘述 詢價
SLM Series Slurry SLM series are colloidal silica-based slurries with the uniquely formulated chemistry designed especially for wafer polishing. SLM series are formulated using colloidal silica with chemical additives to achieve specific performance requirements.
SLR Series Slurry Wafer reclaim, backside polish, 2nm process, polysilicon SLR series slurries are colloidal silica slurries developed for specific use cases in tandem with customers. There are available products for fine and rough polish wafer reclaim, back side polish, SiO2, and polysilicon removal.