蝕刻後清洗劑

品名	敘述	詢價
SPR Series	Logic, IC, Bumping, packaging, legacy process, CoWaS, TSV, ESG SPR series are uniquely formulated chemistry designed specifically for the removal of positive PR and dry etched PR residue. Bumping strippers are formulated chemicals designed specifically for the removal of wet film and dry film and have less metal damage for bumping process.
Stripper and Cleaners	Logic, IC, Bumping, packaging, legacy process, CoWaS, TSV, ESG SPR series are uniquely formulated chemistry designed specifically for the removal of positive PR and dry etched PR residue. Bumping strippers are formulated chemicals designed specifically for the removal of wet film and dry film and have less metal damage for bumping process.
FCS Series	Logic, IC, Bumping, packaging, legacy process, CoWaS, TSV, ESG FCS series are flux cleaner with the uniquely formulated chemistry designed specially for removal of flux. This excellently performing stripper could rapidly remove flux without damage to Cu and Sn in bumping process.
Flux Cleaners	Logic, IC, Bumping, packaging, legacy process, CoWaS, TSV, ESG FCS series are flux cleaner with the uniquely formulated chemistry designed specially for removal of flux. This excellently performing stripper could rapidly remove flux without damage to Cu and Sn in bumping process.