蝕刻劑

品名	敘述	詢價
Copper Etchant for Packaging Process	Bumping, packaging, legacy process, CoWaS, TSV Copper etchants have been developed to address legacy as well as advanced packaging customers. Mature formulations that meet or exceed market leader performance as well as new formulations for fine line processes are available.
Titanium Etchant for Packaging Process	Bumping, packaging, legacy process, CoWaS, TSV Alkaline titanium etchant has been developed for use in both wet bench and spray type tools for the packaging process. Our custom formulation offers superior undercut results, little to no bubble formulation, and long bath life.